Surface Coating / Alfa Chemistry

Underfill Control Coating


Exudation and dispersion of materials such as resins, epoxies, underfills, and other materials can lead to failures in crucial electronic packaging applications. Using protective coatings in chip packing or other PCB applications has a number of performance benefits. Alfa Chemistry has created a number of surface coating technologies that may be used to professionally functionalize the surfaces of precision electronic devices for control and protection.

Our Underfill control layer effectively repels underfills, epoxies, molding compounds, and other adhesives, preventing bleeding failures. Our protective coatings are liquid-phase produced, simple to apply, and available in a variety of selective applications. Please get in touch with us so we can collaborate on successful electronic packaging goods!

Why Do You Need An Underfill Control Coating?

To address a range of difficulties in chip packaging and PCB applications. Here are some examples of situations where you can choose our underfill control coatings to improve product quality.

  • You want to keep the pads clean and free of resin bleed.
  • You don't want to underfill to spread uncontrollably throughout the work area.
  • Due to packaging size restrictions, your goods will not be able to have a physical look.
  • You want to choose simpler defenses because the required physical defense actions are complex.

Underfill Control Coating

Suitable Underfill Control Coating Solution

Alfa Chemistry offers Underfill repellent coatings to prevent underfills, epoxies, and other adhesives from impairing product performance. Easy-to-apply and ultra-thin, these repellent coatings effectively stop material from oozing and spreading. You can choose to use our performance advantage Underfill repellent coating in your chip package or PCB application with confidence.

We can also create an insulating coating of conductive particles to control the thermal conductivity of the underfill material. We prepared alumina-coated silver core/shell structured particles by a sol-gel method. With this coating, the thermal conductivity of the underfill material can reach 2.34 Wm-1 K-1.

Underfill Control Coating

Why Choose Alfa Chemistry?

  • We've been working on a variety of surface modification technologies to help support semiconductor and PCB applications.
  • Our nano-scale underfill control coating is simple to apply, safe, and non-toxic.

If you're having trouble with a semiconductor application, contact us to see how we can improve the quality of your surface.

Our products and services are for research use only and cannot be used for any clinical purpose.

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