Underfill Control Coating
- Surface Coating for Electronics Applications
- Underfill Control Coating
Exudation and dispersion of materials such as resins, epoxies, underfills, and other materials can lead to failures in crucial electronic packaging applications. Using protective coatings in chip packing or other PCB applications has a number of performance benefits. Alfa Chemistry has created a number of surface coating technologies that may be used to professionally functionalize the surfaces of precision electronic devices for control and protection.
Our Underfill control layer effectively repels underfills, epoxies, molding compounds, and other adhesives, preventing bleeding failures. Our protective coatings are liquid-phase produced, simple to apply, and available in a variety of selective applications. Please get in touch with us so we can collaborate on successful electronic packaging goods!
To address a range of difficulties in chip packaging and PCB applications. Here are some examples of situations where you can choose our underfill control coatings to improve product quality.
Alfa Chemistry offers Underfill repellent coatings to prevent underfills, epoxies, and other adhesives from impairing product performance. Easy-to-apply and ultra-thin, these repellent coatings effectively stop material from oozing and spreading. You can choose to use our performance advantage Underfill repellent coating in your chip package or PCB application with confidence.
We can also create an insulating coating of conductive particles to control the thermal conductivity of the underfill material. We prepared alumina-coated silver core/shell structured particles by a sol-gel method. With this coating, the thermal conductivity of the underfill material can reach 2.34 Wm-1 K-1.
If you're having trouble with a semiconductor application, contact us to see how we can improve the quality of your surface.
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