Poly(pyromellitic dianhydride-co-4,4'-oxydianiline), amic acid solution

Basic Information Description Application Features And Benefits

Catalog Number	ACMA00040611
Synonyms	Polyamic acid
Molecular Formula	(C12H12N2O .C10H2O6)x
Boiling Point	174 °C
Density	1.04 g/mL at 25 °C
Grade	electronic grade
NACRES	NA.23
Packaging	10 g in glass bottle
Quality Level	100
Refractive Index	n20/D 1.506
Storage Temperature	−20°C

Description The polymer product is a hydrophobic material that is insoluble in water or other polar solvents.

Application Semi-conductor material. Dielectric component in thin films, high density interconnect systems and multichip modules.

Features And Benefits High purity material with controlled metallic content. Polyimide has good thermal, mechanical and electrical properties.
Filtered through 0.2μm medium

Our products and services are for research use only and cannot be used for any clinical purpose.

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